No full text
Paper published in a book (Scientific congresses and symposiums)
Wafer Bonding with nanoprecision alignment for micro/nano systems
Jiang, Liudi; Pandraud, Gregory; French, Paddy James et al.
2007In TRANSDUCERS 2007
Peer reviewed
 

Files


Full Text
No document available.

Send to



Details



Abstract :
[en] Exploiting mechanical principles of kinematic and elastic averaging, a novel passive approach has been developed to achieve nanoprecision bonding alignment. Alignment features comprising cantilever supported pyramids and V-pits have been designed and fabricated at silicon chip level. The engagement between the pyramids and pits and the compliance of the cantilevers result in the passive alignment. Infrared (IR) and scanning electron microscopy (SEM) inspections repeatedly confirmed the alignment accuracy of better than 200 nm at the bonding interface with good bonding quality. The applicability of the developed alignment technique and future works towards wafer level applications for advanced micro/nano systems are discussed.
Disciplines :
Electrical & electronics engineering
Author, co-author :
Jiang, Liudi
Pandraud, Gregory
French, Paddy James
Spearing, S. Mark
Kraft, Michaël ;  Université de Liège - ULiège > Dép. d'électric., électron. et informat. (Inst.Montefiore) > Systèmes microélectroniques intégrés
Language :
English
Title :
Wafer Bonding with nanoprecision alignment for micro/nano systems
Publication date :
June 2007
Event name :
Proc. Transducers 2007 Conference
Event place :
France
Event date :
june 2007
Audience :
International
Main work title :
TRANSDUCERS 2007
ISBN/EAN :
1-4244-0842-3
Pages :
pp. 2103-2016
Peer reviewed :
Peer reviewed
Commentary :
2103--2106 5
Available on ORBi :
since 20 January 2016

Statistics


Number of views
24 (0 by ULiège)
Number of downloads
0 (0 by ULiège)

Scopus citations®
 
1
Scopus citations®
without self-citations
1
OpenCitations
 
0

Bibliography


Similar publications



Contact ORBi